Download 3D Integration for NoC-based SoC Architectures by Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, PDF

By Chuan Seng Tan (auth.), Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch (eds.)

Back hide reproduction sequence: built-in Circuits and platforms 3D-Integration for NoC-based SoC Architectures by way of: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This ebook investigates at the gives you, demanding situations, and options for the 3D Integration (vertically stacking) of embedded platforms attached through a community on a chip. It covers the total architectural layout method for 3D-SoCs. 3D-Integration applied sciences, 3D-Design options, and 3D-Architectures have emerged as issues severe for present R&D resulting in a huge variety of goods. This publication offers a entire, system-level evaluation of three-d architectures and micro-architectures. •Presents a entire, system-level evaluation of third-dimensional architectures and micro-architectures; •Covers the full architectural layout technique for 3D-SoCs; •Includes cutting-edge therapy of 3D-Integration applied sciences, 3D-Design thoughts, and 3D-Architectures.

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Tan 25. R. Tadepalli, and Carl V. Thompson, Quantitative Characterization and Process Optimization of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits. Proc. of the IEEE 2003 International Interconnect Technology Conference, pp. 36–38, 2003. 26. S. N. Chen, A. Fan, and R. Reif, The Effect of Forming Gas Anneal on the Oxygen Content in Bonded Cu Layer. Journal of Electronic Materials, 34(12), pp. 1598–1602, 2005. 27. N. Chen, A. S. Tan, and R. Reif, Temperature and Duration Effect on Microstructure Evolution During Copper Wafer Bonding.

Com. ╇ 3. J. Dally. Performance analysis of k-ary n-cube interconnection networks. IEEE Transactions on Computers, 39(6):775–785, 1990. ╇ 4. Y. Weldezion, M. Grange, D. Pamunuwa, Z. Lu, A. Jantsch, R. Weerasekera and H. Tenhunen. Scalability of network-on-chip communication architecture for 3-D meshes. Proceedings of the International Symposium on Networks-on-Chip, 2009. ╇ 5. F. G. Friedman. 3-D topologies for networks-on-chip. IEEE Transactions on Very Large Scale Integration Systems, 15(10):1081, 2007.

S. F. G. K. Goulet, and M. Bergkvist, Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol. Applied Physics Letters, 95(19), p. 192108, 2009. 43. F. Lim, J. M. S. Tan, Low Temperature Bump-less Cu–Cu Bonding Enhancement with Self Assembled Monolayer (SAM) Passivation for 3-D Integration. IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, June 1–4, pp. 1364– 1369, 2010. 1â•…Introduction Due to their compact geometry, 3-D integrated systems hold promises to significantly reduce latency, power consumption and area, while increasing bandwidth.

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